Process Engineer
Los Angeles, CA
Mesh Optical Technologies was founded on the belief that photons will unlock the next evolution of human technology. Today, we're putting that vision into practice by developing the world's most advanced optical computing hardware.
We believe in engineering to the limit of physics, building our own factories, and writing software that maximizes the capability of our hardware. As we embark on this journey, we're seeking a Process Engineer who is motivated by our goal to operate the highest volume optical manufacturing facility in North America.
As our Process Engineer, you'll play a critical role in the development and launch of our first product:
Optical Interconnects — High-bandwidth optical interconnects are fundamental to the future of computing. Producing them at scale demands precision manufacturing and highly reliable equipment. As our Process Engineer, you'll be hands-on with the core operations of our production line, ensuring high uptime and repeatability across tools for flip-chip bonding, wafer processing, plasma cleaning, and wire bonding. You'll monitor tool performance, troubleshoot issues in real time, and implement process improvements that directly impact yield and throughput. Working closely with engineering, you'll refine critical steps in the manufacturing flow and help scale our factory to meet growing demand.
What you'll do
- Own day-to-day operation and uptime of production tools including flip-chip bonders, plasma cleaners, wafer handlers, and wire bonders.
- Monitor and control key process parameters, ensuring repeatability, equipment calibration, and adherence to manufacturing specs.
- Troubleshoot tool and process issues in real time, minimizing downtime and driving fast root-cause resolution.
- Collaborate with engineering teams to refine and stabilize process flows for die attach, bonding, cleaning, and packaging.
- Analyze production data and yield trends, identifying opportunities for process optimization and defect reduction.
- Support factory scaling efforts, qualifying new tools and recipies that enhance unit throughput and yield.
Basic Qualifications
- B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or a related field.
- Hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments.
- Familiarity with equipment and processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding.
- Strong troubleshooting skills with experience maintaining high-uptime operation of precision manufacturing tools.
- Ability to interpret process documentation, equipment specifications, and production data to drive consistent output.
- Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams.
- Willingness to work extended hours and weekends as needed.
Preferred Qualifications
- Direct experience qualifying or operating production equipment in a high volume production environment.
- Knowledge of eutectic bonding, underfill processes, and die attach materials used in high-density packages.
- Familiarity with statistical process control and root cause analysis methods.
- Background in process development or yield improvement for optical, photonic, or microelectronic devices.
Compensation and benefits
- Competitive cash salary commensurate with experience and merit.
- Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements.
- Comprehensive medical, vision, and dental insurance.
- Paid parental leave and flexible PTO (3 weeks vacation + 10 company holidays).
- Relocation assistance to sunny Los Angeles.
Apply
Send your resume to join at meshoptical dot com.